Some recent Samsung Exynos chips have suffered from overheating, but the company will apparently use PC-derived tech for future Exynos chips.
  • limerod@reddthat.comOPEnglish
    1·
    4 months ago

    TL;DR

    • Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
    • This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
    • Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.